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CVE-2018-5837

N/A
Published: September 20, 2018 at 01:00 PM UTC
Updated: June 17, 2026 at 02:00 AM UTC
59 products affected across 1 vendorMDM9607 FirmwareMDM9206 FirmwareQCA6574AU Firmware

Using Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear by Qualcomm, Inc.?

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Severity
N/A
Exploit prediction
EPSS 0.6%

Description

In Snapdragon (Automobile, Mobile, Wear) in version IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests is not done properly due to a flawed RNG which produced repeating output much earlier than expected.

Affected

Our own answer: ranges merged, affected separated from platform-only, with confidence and review flags.

Remediation

No guide yet

No remediation guidance has been written for this CVE yet. What the record does show:

Patch and advisory references

References (2)

x_refsource_CONFIRMVendor Advisory
Source: [email protected]
https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components
x_refsource_CONFIRMVendor Advisory
Source: [email protected]
https://www.qualcomm.com/company/product-security/bulletins

CVSS

5MEDIUM[email protected]
Confidentiality
NONE
Integrity
PARTIAL
Availability
NONE
Vector?

Quick Info

StatusMODIFIED
CWE
CWE-338

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