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CVE-2018-11982

N/A
Published: September 20, 2018 at 01:00 PM UTC
Updated: June 17, 2026 at 01:36 AM UTC
58 products affected across 1 vendorMDM9607 FirmwareMDM9206 FirmwareSd 835 Firmware

Using Snapdragon Mobile, Snapdragon Wear by Qualcomm, Inc.?

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Severity
N/A
Exploit prediction
EPSS 0.4%

Description

In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.

Affected

Our own answer: ranges merged, affected separated from platform-only, with confidence and review flags.

Remediation

No guide yet

No remediation guidance has been written for this CVE yet, and no fixed version or vendor advisory is recorded against it.

References (1)

x_refsource_CONFIRMThird Party Advisory
Source: [email protected]
https://www.qualcomm.com/company/product-security/bulletins

CVSS

8.3HIGH[email protected]
Confidentiality
COMPLETE
Integrity
COMPLETE
Availability
COMPLETE
Vector?

Quick Info

StatusMODIFIED
CWE
CWE-415

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