CVE-2018-11277

N/A
Published: September 20, 2018 at 01:00 PM UTC
Updated: June 17, 2026 at 01:35 AM UTC
43 products affected across 1 vendorSd 835 FirmwareMSM8909W FirmwareMSM8996AU Firmware

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Severity
N/A
Exploit prediction
EPSS 0.2%

Description

In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.

Affected

Our own answer: ranges merged, affected separated from platform-only, with confidence and review flags.

All versions
qualcomm-sd212 (same device)
All versions
qualcomm-sd415 (same device)
All versions
qualcomm-sd430 (same device)
All versions
qualcomm-sd615 (same device)
All versions
qualcomm-sd616 (same device)

Remediation

No guide yet

No remediation guidance has been written for this CVE yet. What the record does show:

References (1)

CVSS

Confidentiality
PARTIAL
Integrity
PARTIAL
Availability
PARTIAL
Vector?

Quick Info

StatusMODIFIED
CWE
CWE-732

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