CVE-2018-11264
Using Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear by Qualcomm, Inc.?
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Description
Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.
Affected
Our own answer: ranges merged, affected separated from platform-only, with confidence and review flags.
Remediation
No guide yetNo remediation guidance has been written for this CVE yet. What the record does show:
Patch and advisory references
References (2)
Quick Info
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