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CVE-2017-18329

N/A
Published: January 3, 2019 at 03:00 PM UTC
Updated: June 17, 2026 at 01:12 AM UTC
76 products affected across 1 vendorMDM9650 FirmwareSd 835 FirmwareMSM8909W Firmware

Using Snapdragon Mobile, Snapdragon Wear by Qualcomm, Inc.?

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Severity
N/A
Exploit prediction
EPSS 0.2%

Description

Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 835, SD 845 / SD 850, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

Affected

Our own answer: ranges merged, affected separated from platform-only, with confidence and review flags.

Remediation

No guide yet

No remediation guidance has been written for this CVE yet. What the record does show:

Patch and advisory references

References (2)

VDB Entryx_refsource_BIDThird Party Advisory
Source: [email protected]
http://www.securityfocus.com/bid/106128
x_refsource_CONFIRMx_refsource_MISCVendor Advisory
Source: [email protected]
https://www.qualcomm.com/company/product-security/bulletins

CVSS

7.2HIGH[email protected]
Confidentiality
COMPLETE
Integrity
COMPLETE
Availability
COMPLETE
Vector?

Quick Info

StatusMODIFIED
CWE
CWE-119

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