CVE-2017-18323

N/A
Published: January 3, 2019 at 03:00 PM UTC
Updated: June 17, 2026 at 01:12 AM UTC
73 products affected across 1 vendorMDM9607 FirmwareMDM9206 FirmwareMDM9650 Firmware

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Severity
N/A
Exploit prediction
EPSS 0.2%

Description

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.

Affected

Our own answer: ranges merged, affected separated from platform-only, with confidence and review flags.

Remediation

No guide yet

No remediation guidance has been written for this CVE yet. What the record does show:

References (2)

VDB Entryx_refsource_BIDThird Party Advisory
http://www.securityfocus.com/bid/106128
x_refsource_CONFIRMx_refsource_MISCVendor Advisory
https://www.qualcomm.com/company/product-security/bulletins

CVSS

Confidentiality
PARTIAL
Integrity
NONE
Availability
NONE
Vector?

Quick Info

StatusMODIFIED
CWE
CWE-320

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