CVE-2017-18305
N/A
Published: October 23, 2018 at 01:00 PM UTC
Updated: June 17, 2026 at 01:12 AM UTC
16 products affected across 1 vendorMDM9607 FirmwareMDM9206 FirmwareMDM9650 Firmware
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Severity
N/A
Exploit prediction
EPSS 0.2%
Description
XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.
Affected
Our own answer: ranges merged, affected separated from platform-only, with confidence and review flags.
All versions
All versions
All versions
All versions
All versions
All versions
Remediation
No guide yetNo remediation guidance has been written for this CVE yet. What the record does show:
Patch and advisory references
References (3)
VDB Entryx_refsource_SECTRACKThird Party Advisory
Source: [email protected]
http://www.securitytracker.com/id/1041432x_refsource_CONFIRMThird Party Advisory
Source: [email protected]
https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-componentsx_refsource_CONFIRMx_refsource_MISCVendor Advisory
Source: [email protected]
https://www.qualcomm.com/company/product-security/bulletinsQuick Info
StatusMODIFIED
CWE
NVD-CWE-noinfo
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