CVE-2017-18140
Using Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear by Qualcomm, Inc.?
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Description
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur.
Affected
Our own answer: ranges merged, affected separated from platform-only, with confidence and review flags.
Remediation
No guide yetNo remediation guidance has been written for this CVE yet. What the record does show:
Patch and advisory references
References (2)
Quick Info
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